Compute, memory, storage, and connectivity demands are forcing the industry to adapt as it meets the expanding needs of cloud, edge, enterprise, 5G, and high-performance computing. UCIe — Universal Chiplet Interconnect Express — is an open industry standard founded by the leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers to address customer requests for more customizable package-level integration.

High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure to meet the demands of the emerging compute landscape. Applications such as artificial intelligence, machine learning, data analytics, 5G, automotive, and high-performance computing are driving these demands to meet the needs of cloud computing, intelligent edge, enterprise, and client computing infrastructure.

For the past three decades, PCI-SIG® has delivered a succession of industry-leading PCI Express® (PCIe®) specifications that remain ahead of the increasing demand for a high-bandwidth, low-latency interconnect for compute-intensive systems in storage applications and diverse market segments. In 2022, PCI-SIG announced the PCIe 7.0 specification is targeted for release to members in 2025.

CXL, an open industry standard interconnect, addresses the growing high-performance computational workloads to support heterogeneous processing and memory systems with applications in Artificial Intelligence, Machine Learning, Analytics, Cloud Infrastructure, Cloudification of the Network and Edge, communication systems, and High-Performance Computing by enabling coherency and memory semantics on top of PCI Express® (PCIe®) based I/O semantics to optimize performance in evolving usage models.

UCIe™ (Universal Chiplet Interconnect Express™) is an open industry that defines the interconnect offering high-bandwidth, low-latency, power-efficient, and cost-effective on-package connectivity between chiplets.

The UCIe 1.1 Specification delivers valuable improvements that extend reliability mechanisms, provide enhancements for the automotive industry, enable lower-cost implementations, and establish compliance and interoperability testing specifications to establish a vibrant chiplet ecosystem.