SNIA Developer Conference September 15-17, 2025 | Santa Clara, CA
Mohiuddin Mazumder
Principal Engineer, Data Center Group
PCI-SIG, Intel
Mohiuddin Mazumder is a Principal Engineer in Data Center Group at Intel Corporation. He leads pathfinding and development work for high-speed serial links such as PCIe and Intel’s UltraPath Interconnect. He is a co-chair of the PCI-SIG Electrical Work Group. Mohiuddin joined Intel in 1996 after obtaining his Ph.D. in Applied Physics from Yale University.
Related Sessions
PCIe® 6.0: A High-Performance Interconnect for Storage Networking Challenges
Over the past nearly three decades, PCI-SIG® has delivered a succession of industry-leading specifications that remain ahead of the curve of the increasing demand for a high-bandwidth, low-latency interconnect for compute-intensive systems in diverse market segments, including data centers, PCs and automotive applications. Each new PCI Express® (PCIe®) specification consistently delivers enhanced performance, unprecedented speeds, and low latency – doubling the data rate over previous generations. The PCIe 6.0 specification – targeted for final release in 2021 – will deliver 64 GT/s data rate (256 GB/s via x16 configuration), while maintaining backward compatibility with previous generations. In this session, attendees will learn the nuts and bolts of PCIe 6.0 architecture and how it will enable high-performance networking. Some key features of the upcoming specification include PAM4 encoding, low-latency Forward Error Correction (FEC), and backward compatibility with all previous generations of PCIe technology. This presentation will also highlight PCIe 6.0 technology use cases and the heterogenous computing applications that will be accelerated by PCIe 6.0 technology, including artificial intelligence, machine learning and deep learning. Finally, attendees will receive an update on the release timeline of the PCIe 6.0 specification later this year and rollout of the interoperability and compliance program.
PCIe® Cabling Solutions for Next Generation AI, HPC and Storage Applications
As the need for PCI Express® (PCIe®) cabling has grown, PCI-SIG® has kept pace with the industry demand for high-speed cabling solutions in applications like disaggregated servers, data center networking, storage, AI, automotive and more. In May 2024, PCI-SIG released the CopprLink™ Internal and External specifications for PCIe 5.0 and 6.0 technology, providing internal and external cabling solutions at 32.0 and 64.0 GT/s.
The release of CopprLink Internal and External specifications is part of PCI-SIG’s mission to offer PCIe cabling solutions that meet a wide variety of evolving industry needs. CopprLink internal cabling specification leverages the SNIA SFF-TA-1016 connector form factor for target applications like storage, data center compute nodes. CopprLink External specification leverages the SNIA SFF-TA-1032 connector form factor, targeting applications like storage and data center AI/ML use cases.
PCI-SIG is also developing a new external cabling specification, based on the well-established SNIA SFF-8614 connector form factor, more commonly known as “MiniSAS-HD” for its typical use in storage applications. The completion of the PCIe External Cabling Specification supports three successive generations of PCIe data rates (8.0, 16.0, and 32.0 GTs/s) and positions the PCIe technology as the fastest option among remote storage alternatives in the Enterprise market.
By providing internal and external cables of varying speeds and reach that utilize existing connector form factors, PCI-SIG is ensuring the industry can choose the best PCIe cabling solution for their applications. Utilizing existing, well-established connector form factors speeds up adoption, time to market and reduces cost. Along with CopprLink Internal and External specifications, PCI-SIG is exploring an optical interconnect for data-demanding applications like AI, cloud computing and HPC.
Attendees will receive an overview of current PCI-SIG cabling efforts, including CopprLink Internal and External Specifications and PCIe External Cabling Specification. They will also learn more about the application space for PCIe cabling, including data center networking, AI, storage and more.