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SNIA Developer Conference September 15-17, 2025 | Santa Clara, CA

Suresh Rajgopal

SSD Systems Architect - DMTS

Micron Technology

Suresh Rajgopal is a storage technologist working on Enterprise SSD system architecture and storage deployment of AI solutions. He has been with Micron Technology since 2010, working in areas of Storage Systems for AI, SSD systems architecture, advanced power and packaging technology and ASIC development of flash controllers, for client, enterprise and managed NAND products.

Gen6 is coming, but what is Needed from NV Storage?

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The rapid advancement of AI is significantly increasing demands on compute, memory and the storage infrastructure. As NVMe storage evolves to meet these needs, it is experiencing a bifurcation in requirements. On one end, workloads such as model training, checkpointing, and key-value (KV) cache tiering are driving the need for line-rate saturating SSDs with near-GPU and HPC attachment.

Why does NVMe need to evolve for efficient storage access from GPUs?

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Abstract With its introduction in 2011, the NVMe storage protocol has allowed CPUs to handle more data with less latency. This in turn has significantly improved the CPU's ability to manage parallel tasks with multiple queues while improving CPU utilization rates. More recently, the growing relevance of GPUs in AI training and inference has led to innovations that illustrate enabling NVMe storage access directly from GPUs. In this presentation we discuss some challenges with doing this efficiently.

Does Gen6x4 Make Sense for SSDs Claiming 25W Due to Standard Form Factor Recommendations

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Should SSDs supporting power states higher than the maximum TDP dissipation supportable in a system? Many industry standards for drive form factors are targeting =25W, but will Gen6 SSDs be viable in a x4 configuration or will these form factors be abandoned? What is proposed is a framework currently supported in NVMe and OCP's Datacenter NVMe SSD Specification of allowing enhanced latencies in cases where there is thermal margin above the maximum TDP of the form factor using either host orchestrated NVMe power state management or device orchestrated Host Controlled Thermal Management.

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