Maximizing E3.L 2T: Engineering Ultra‑Dense QLC SSDs

NAND flash density continues to increase, yet capacity SSDs still struggle to displace Nearline HDDs in datacenter deployments. One path forward is to maximize the amount of QLC NAND flash that can be integrated within existing traditional EDSFF form factors. This session examines how the E3.L 2T form factor—typically used for computational storage due to its thermal headroom—can be engineered for maximum density. By fully utilizing the 2T height for QLC NAND, we explore the architectural, mechanical, and power‑thermal considerations required to build ultra‑dense SSDs. Topics include signal‑integrity constraints, controller placement, thermals, airflow interaction, and mechanical packaging tradeoffs. This engineering approach can rival many system‑level characteristics of Nearline HDD deployments. Attendees will gain practical insight into how the E3.L 2T form factor can be leveraged to build next‑generation capacity SSDs for large‑scale storage systems.