SNIA Developer Conference September 15-17, 2025 | Santa Clara, CA
Anthony Constantine
Distinguished Member of Technical Staff
Micron Technology
Related Sessions
Why should we have yet another Enterprise and Datacenter Standard Form Factor for SSDs?
Since the Enterprise and Datacenter Standard Form Factor (EDSFF) was created, the biggest complaint about EDSFF has been that there are too many form factors. While this was by design, EDSFF still has more form factors than what was supported previously in Enterprise and Datacenter application. So introducing E2 as a new EDSFF form factor in the market is obviously going to get a lot of scrutiny. The goal of this presentation is to discuss the motivation behind creating the EDSFF E2 form factor, why existing form factors could not meet this need, why the EDSFF E2 form factor ended up with the specific dimensions, and what do future applications look like.
448G/lane? PCIe™ 7.0? E2 form factor? Suffer the egos of the opinionated experts working to meet the bandwidth, interconnect, and capacity for these AI capable interconnects and form factors.
The bandwidth and capacity demand explosion of AI are forcing interconnects and storage to rapidly adapt and evolve. Pushing the bandwidth challenges the limits of the copper interconnect. The SNIA SFF Technical Working Group is proactively addressing the bandwidth needs through new development work on 448G channel modeling and PCIe 7.0 projects as well as studying mechanical aspects of the system design. In addition, there is a focus on how to meet the capacity and performance needs of storage for AI through a new EDSFF form factor. Come ask our panel of experts questions to help better understand what is being done now to push these limits.
