EDSFF for Storage, Memory and Acceleration

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Tuesday, June 8, 2021
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Challenges facing system designers, mother board designers are: Space, Performance and Cost. Increasing the data-rate of electrical interfaces on PCB, increases cost of manufacturing and add to other engineering challenges. Dedicated pins on the CPU sockets for DDR like interfaces are limited.

EDSFF standard SFF-TA-1002, 1009 standardize the electrical and mechanical outline of devices. This ensures same server chassis can support combination of profiles from different vendors. Individual form-factor spec like 1006 and 1008 define power, thermal budget, and airflow conditions enforcing commonality between modules from various vendors.

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