Gen-Z: High-Performance Interconnect for the Data-Centric Future

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Publish Date: 
Wednesday, September 26, 2018
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The public release of the Gen-Z Core Specification 1.0 enables silicon providers and IP developers to begin the development of products enabling Gen-Z technology solutions. This presentation outlines how Gen-Z will address the multiple server challenges brought on by the explosion of data (180ZB annually by 2025) and the need for a high-speed, low-latency, scalable, memory-centric fabric. Customers have more data and require more processing of that data, and to be competitive, companies must monetize that data. Memory fabric is the missing piece because it addresses the rise of microsecond devices and enables a memory-centric architecture and full composability. This presentation explains the seven tenets of Gen-Z and its attributes for scale-out solutions. You’ll also hear what’s next for the consortium as it continues to grow and develop new specifications for the industry.