Maximizing EDSFF E3 SSD design
The EDSFF E3 form factors bring more options and commonality that enterprises and hyperscalers desire compared to traditional U.2, but also bring new challenges. With power envelopes increasing in many cases, it is difficult to fit more components on board to maximize capabilities. With a lack of E3 enclosures on the market, there many uncertainties like enclosure geometries and airflow profiles, and the uncertainty of total system power delivery capability.