SFF Specifications
The following explains the fields of the database.
Date - The date on the latest version of the SFF document. If the document is published and there is no new draft available, this will be the date on the published document. If there is a new draft available, this date will represent the date of the latest draft.
ID - The document ID.
Title -The title of the document.
Status - Reflects the following for the most recent version of the document:
- Published - Documents that have been completed and approved for publication. The revision number listed for the published document will be linked to a copy of the latest published revision of the document.
- Draft - Draft documents that have been made available for public review and comment. The revision number listed for the draft will be linked to a copy of the latest draft.
- Expired - Documents that are no longer maintained by the SFF TWG. Expired documents contain a cover page providing the reason for being expired (i.e., superseded, canceled, voided, obsolete, other).
- New Project Initiated - This indicates that a new project has been initiated and no draft is available yet, either for a new document or a new revision to an existing previously published document. When possible, this may be linked to a copy of the New Project Proposal slides.
| Date | ID | Title | Status |
|---|---|---|---|
| SFF-TA-1016 | Internal Unshielded High Speed Connector System | Published 1.3, 2024-11-15 New Project Initiated | |
| SFF-TA-1044 | Hybrid Orthogonal EDSFF Connector System | Published 1.0, 2026-03-27 | |
| SFF-TA-1045 | Pin and Signal Definition for the Hybrid Orthogonal EDSFF Connector Specification | Published 1.0, 2026-03-13 | |
| SFF-TA-1009 | Enterprise and Datacenter Standard Form Factor Pin and Signal Specification (EDSFF) | Published 4.1a, 2025-05-04 New Project Initiated | |
| SFF-TA-1002 | Protocol Agnostic Multi-Lane High Speed Connector | Published 1.6a, 2025-05-16 New Project Initiated | |
| SFF-TA-1006 | Enterprise and Datacenter 1U Short Device Form Factor (E1.S) | Published 2.0, 2025-12-19 | |
| SFF-TA-1047 | Automotive EDSFF Interconnect | New Project Initiated | |
| SFF-TA-1046 | EDSFF AE1.S | New Project Initiated | |
| SFF-TA-1008 | Enterprise and Datacenter Standard Form Factor (E3) | Published 2.1, 2023-10-31 Draft 2.1.2 | |
| SFF-TA-1007 | Enterprise and Datacenter 1U Long Device Form Factor (E1.L) | Published 1.3, 2025-09-02 | |
| SFF-TA-1042 | Enterprise and Datacenter 2U Form Factor (E2) | Published 1.0, 2025-06-16 | |
| SFF-TA-1034 | Pluggable Multi-Purpose Module | Published 1.0a, 2024-06-18 | |
| SFF-TA-1020 | Cables and Connector Variants Based on SFF-TA-1002 | Published 1.1, 2023-11-06 | |
| SFF-TA-1023 | Thermal Characterization Specification for EDSFF Devices | Published 1.0a | |
| REF-TA-1012 | Pin Assignment Reference for SFF-TA-1002 Connectors | Published 1 |
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See the letter from the SNIA Secretary for additional details regarding disclosures of intellectual property (IP) claims, including how to make a disclosure. Questions not specific to a document should be submitted by e-mail to tcadmin@snia.org.